INTEGRAL COOLING MICROSYSTEM FOR HIGHER POWER ELECTRONICS MODULES

Future multi-chip modules (MCMs) for radar and power electronics will need to operate at higher power densities. However, current power electronics modules are approaching operating limits due to the limited effectiveness of conventional techniques for heat removal via backside cooling. We propose to develop a micromachined cooling system for multi-chip modules which can enable dramatically higher power levels to be achieved by directly cooling the power-producing junctions on the chips. The system has no moving parts and is completely self-contained within the multi-chip modules. Therefore, the proposed system is simple to integrate into aircraft systems. In Phase I, we will demonstrate feasibility through proof-of-concept tests, thermal analysis, and design integration.