Rugged, Hermetically-Sealed Vertical-Cavity, Surface-Emitting Laser Array Packages for Avionics

We propose to develop ruggedized, hermetically-sealed, low-profile SEM-E-compatiable packages incorporating temperature-insensitive laser arrays for optically interconnecting electronic processing modules through parallel fiber ribbons. Photonics Research Incorporated will team with Unisys Corporation to combine expertises in fabricting arrays of vertical-cavity surface-emitting lasers (VCSELs, tradnamed LASE-ARRAY BY PRI) and in amnufacturing ruggedized avionic systems. VCSELs are ideally suited for inexpensive passively-aligned micro-optic packages which do not require thermoelectric coolers. In Phase I we will: 1) evaluate passive-alignment bonding, sealing and optical tolerance for low-cost automation; 2) evaluate thermal dissipation and optical performance using CAD; 3) fabricate temperature-insensitive LSE-ARRAYs; 4) assemble a breadboard optical interconnection and test the bit error rate for both signle- and multi-mode VCSELs; and5) develop the Phase II plan for demonstration and commericalization. In an option plan, we will: 1) peform reliability tests on the LASE-ARRAYs 2) design LASE-ARRAYs specific ally for for multi-mode avionic fiber links (reliabililty, passively-aligned packaging,higher temperature insensitivity and optimum modal structure); and 3) design LASE-ARRAY SEM-E modules for avionic fiber links.