HIGH PERFORMANCE BIOSENSOR ELECTRODE MATERIALS

Not Available Foster-Miller Inc. in this project proposes to develop new and innovative solutions to the packaging of vertical cavity surface emitting lasers (VCSELs) utilized in highly parallel optical interconnections for communications within and between processor units. Packaging of these devices to date has suffered in several areas, principally cost, simplicity of alignment and immunity to shock and vibration. Our approach uses coefficient of thermal expansion (CTE) matched liquid crystal polymer (LCP) to provide low-cost assembly. This material will be combined with advanced heatsinking materials to provide highly reliable CTE matched VCSEL array packaging for parallel interconnect applications that is amenable to expansion to large arrays. BENEFITS: This development of cost-effective, and reliable packaging for free space, parallel optical interconnections will allow rapid expansion in the use of parallel processing in applications requiring compact processors as well as the development of compact, high throughput telecommunications switches.