Z-Fiber for Improved Through Thickness Thermal Conductivity of MMC's

Aztex has developed a technology to reinforce composites called Z-Fiberr insertion. Normally standard carbon fiber pins are inserted through the thickness of an uncured carbon prepreg laminate using ultrasonic energy. The resulting product has superiordamage tolerance. It is possible to adapt this process to use thermally conductive pins and to insert them in the Z direction through a pitch based precursor prior to infiltration of the precursor. We expect that the result will be to produce an MMC platewhich will have excellent x, y and Z thermal properties. Aztex will team with MMCC to research this concept. Aztex will refine the insertion technology and MMCC will make the final plates and measure the thermal properties. MDA are seeking innovativeapproaches to improve baseline technologies. A particular problem is thermal management for concentrated local heat sources. Typically through the thickness, i.e. Z properties are not so good as x/y properties. Aztex has a proven concept that is alreadybeing used on the F/A 18 E/F aircraft when multiple carbon fiber pins are being inserted using Ultrasonics through the thickness of composite structure. It is anticipated that if thermally conductive pins are used the thermal properties of an MMC laminatecan be substantially improved. Aztex already has a proven track record of commercialization.