Nanostructured Polymer/Ceramic Composites for Electronic Packaging

Advances in microelectronics not only require fast and reliable semiconductor chip but also an equally fast and reliable packaging. Low dielectric constant, high thermal conductivity, and desired thermal expansion coefficient are key requirements for high performance electronic packaging materials. Neither ceramics nor polymers can satisfy all these requirements simultaneously. Composites, if probably engineered, may provide unobtainable properties with ceramics or polymers alone. This effort seeks to develop nanostructured polymer-ceramic composites through compositional and microstructural design, which will provide unmatchable combination of dielectric constant, thermal conductivity, thermal expansion coefficient, and other properties. Phase I will systematically establish the proof-of-concept; Phase II will optimize, scale-up and qualify the novel approaches; Phase III will commercialize the technology.