Ultra-High-Heat-Flux Dissipation using Muti-Level Enhancement

Despite numerous recent developments in the area of thermal management, there is now a critical shortage of cooling schemes that can handle anticipated heat loads in many military and commercial applications. The lack of effective cooling schemes hasemerged as an obstacle to electronic packaging at the device, module, and system levels. This study incorporates liquid cooling techniques and capitalizes upon the merits of phase-change (boiling) to dissipate a broad range of heat fluxes corresponding tomodest increases in device temperature. By carefully controlling the liquid coolant temperature, it is possible to influence bubble volume, extend cooling potential, and simplify the coolant conditioning loop. Significant improvements in coolingperformance will be achieved by incorporating powerful surface enhancement techniques which influence heat dissipation on both the macro and micro scales. The Phase II study will exceed 1000 watts per square centimeter from a module containing a multitudeof heat sources in order to serve defense needs for decades to come. The Phase II study will also result in practical cooling hardware tailored to specific defense applications.The proposed work is anticipated to provide thermal management solutions for future defense and commercial electronic and power systems. Examples include spacecraft, high-power-density lasers, military avionics, superomputers, nuclear fusion reactors, andx-ray medical devices.