Reduced Emission Magnetic IC (REMIC) Packaging Material

The need for new IC package system to reduce RF emissions and to enhance thermal conductivity require the developmnet of new materials. These materials are designed from an RF standpoint with additives to reduce thickness and weight while promoting thermaldissipation. A study of the properties of such package mateials is proposed. Devices that require low RF emissions and immunity from RF intereference. Computer systems and comunications systems that must operate in high RFI or EMC enviroments such asfactories that use automatic digitally controlled welding machines.