STTR Phase I: Flexible Flip Chip Connection (F2C2) Technology

The Small Business Technology Transfer Research (STTR) Phase I project will advance a modified electronic packaging technique by attaching a silicon chip to a chip carrier using an area array of flexible wires, named Flexible Flip Chip Connection (F2C2) technology. F2C2 uses flexible copper wires as a medium to connect the die to the chip carrier in lieu of solder balls used in current flip chip packaging . This research effort will focus on optimum design and development of F2C2 structure, materials, and process considering reilability, yield.cost and environment.The proposed technology will help eliminate the dependency on lead-based solders; and will solve the coefficient of thermal expansion mismatch problem in electronic packages, thereby improving the reliability of electronic components. This technology will also be potentially applicable to MEMS packaging and other small-scale packages.