Flexible Processor Packaging for Advanced Interceptors

"The commercial industry is agressive to reduce size and weight to meet the demands of portable consumer electronics. Smaller component footprints and flexible circuits are key to this high density packaging. We are proposing to apply these approaches anddevelop an innovative flexible interceptor processor. Phase 1 will capture the commercial technology roadmap of electronics packaging. In addition, the best approach for a ruggedized solution for an interceptor application will be defined. Design,Hardware build and evaluation will be addressed in Phase 2. The proposed program will determine the feasibility of applying the advanced high density packaging approaches of portable consumer electronics to interceptor applications."