THERMAL MANAGEMENT OF EXCESS HEATING IN ELECTRONIC DEVICES

SPARTA, INC. PROPOSES A PROGRAM TO ASSESS THE FEASIBILITY AND IMPLICATIONS OF USAGE OF ULTRA-HIGH THERMAL CONDUCTIVITY OF PITCH FIBERS IN THE DISSIPATION OF VERY HIGH HEAT LOADS BEING DEVELOPED IN THE ELECTRONIC OMPONENTS OF NAVY WEAPONS, SHIP AND SUBMARINE SYSTEMS. THERE ARE THREE INNOVATIVE MATERIAL DEVELOPMENT CONCEPTS IN THIS STUDY. FIRST, EVALUATION OF TWO AND THREE-DIMENSIONALLY REINFORCED HIGH THERMAL CONDUCTIVITY PITCH GRAPHITE FIBER WOVEN INTO A METAL MATRIX COMPOSITE HEATSINK. SECOND, EVALUATION OF METAL COATED HIGH CONDUCTIVITY FIBERS IN A RESIN MATRIX COMPOSITE. THIRD, EVALUATION OF THE DESIGN OF A COMPOSITE WITH ENCAPSULATED PHASE CHANGE MATERIAL FOR LOCAL ABSORPTION OF HIGH RAPID PULSED HEAT LOADS. THE FEASIBLE CONCEPTS(S) WILL BE EVALUATED IN A COMPUTER SUB ELEMENT FINITE ELEMENT MODEL OF A PRINTED CIRCUIT BOARD, FORMAT E MODULE AND ACTIVE COOLING SUPPORTS. THE PROGRAM WILL ALSO INCLUDE MANUFACTURE OF MANUFACTURE OF THE COMPITE. THE STUDY APPROACH IS A FOLLOWS: (1) ASSESSMENT OF SYSTEM REQUIREMENTS; (2) SELECTION OF CONSTITUENTS; (3) PARAMETRIC ANALYTICAL DESIGN OF COMPONENTS; (4) FABRICATION OF A TYPICAL COMPONENT; (5) TESTING OF THE COMPONENT; (6) ASSEMBLY OF A TECHNOLOGY DEVELOPMENT PLAN.