Fabrication of 2-D Array Transducers Using Thick Film/LTCC-M Hybrid Microelectronic Technology

This SBIR project will establish the potential of thick film LTCC (low temperature co-fired ceramic) technology for the fabrication of two-dimensional array transducers for ultrasonic imaging. The development of thick film piezoelectric inks offers the ability to fabricate large (nxm) element arrays with fine scale features having good dimensional tolerance. Additional merits include element shaping for transverse mode decoupling and reduced cross talk as well as multilayering for increased capacitance. Combined with LTCC technology, integral PZT/substrate bond can be achieved with the necessary electrical interconnects and isolation. The fabrication of acoustic backing materials, e.g. W/recrystallizable glass composites, will be the basis for the development of additional functional materials including resistors, conductors and inductors, which can be integrated into the LTCC package, providing enhanced transducer performance, reliability and miniaturization. The Phase I program will provide a basis for further development of LTCC materials and technology in Phase II leading to the manufacturing of a new family of high performance ultrasonic imaging probes for both underwater and biomedical imaging.