SBIR/STTR Research Award

POLYIMIDE QUARTZ MULTILAYER BOARD

Award identifier 1cd23503cb8c1cb9244c45c31844f0896b73746410e30c22b114f6cd3d1b43bfAwarding agency Department of Defense · Navy

Award amount

$51,014

Program and phase

SBIR · Phase I

Award year

1987

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Award details

Awarding agency
Department of Defense
Branch
Navy
Recipient company
A.i. Technology Inc
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

A POLYIMIDE BASED POLYMER ALLOY IS PROPOSED TO BE USED AS THE MATRIX FOR A QUARTZ FILLED MULTILAYER CIRCUIT BOARD. POLYIMIDE WHICH HAS THERMAL EXPANSION COEFFICIENT (TEC) OF 30 PPM/DEG C IS SUBSTANTIATLY LOWER THAN THAT OF EPOXY (50-60 PPM/ DEG C). THE POLYMER ALLOY WHICH CONSISTS OF RIGID-RODLIKE MOLECULES, HOWEVER, WILL HAVE TEC AS LOW AS 10-20 PPM/DEG C. QUARTZ FIBER FILLED IN DIFFERENT GEOMETRIC ARRANGEMENTS AS WELL AS QUARTZ POWDER AND FLAKE WILL BE STUDIED FOR THEIR EFFECTS ON TEC OF THE MULTILAYER BOARD. EMPHASIS WILL BE ON THE FABRICATION PROCEDURES. THERMOPLASTIC POLYIMIDE (TPI) BASED ALLOYS CAN BE PROCESSED USING CASTING, EXTRUSION, AND MODELING TECHNIQUES. THERMOSET POLYIMIDE BASED ALLOYS CAN BE PROCESSED USING THE SAME TECHNOLOGY DEVELOPED FOR EPOXY. METHODS TO IMPROVE MOISTURE RESISTANCE, THERMAL CONDUCTIVITY, AND MECHANICAL PROPERTIES ARE ALSO DISCUSSED.

Technology keywords

Not reported

Agency intelligence

Department of Defense

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