Global Free Space Smart Optical Interconnects for C3I Computational Technologies

Solicitation AF93-035 requires the development of innovative concepts for increasing the warfighting capabilities of the Air Force command, control, communications and intelligence (C3I) investigation. The proposed effort addresses the establishment of planar (N4) and volume (N5) "smart" global (multi-dimensional) optical interconnects for digital optoelectronic computing hardware. The purpose of the program is to define, develop, and map C3I algorithms and related subroutines into 4-dimensional optical interconnects. Once mapped efficiently, these optical interconnect configurations are to be incorporated into 2-dimensional planar holographic optical interconnect (hardware) elements (HOIEs). Ultimately, reconfigurable 3-dimensional volume holographic optical interconnects elements (V-HOIEs) for N5 "smart" optical interconnects will be incorporated into the final design. By implementing "smart" pixel technology coupled with free space global optical interconnects, two primary objectives will be accomplished. The first objective is to generate algorithms and subroutines for mapping into 2D arrays (32 x 32) of thin planar holographic optical interconnects (HOIE) as well as the HOIE hardware technology required. This HOIE program will be leveraged with current 2-D GaAs DANE (detection, amplification negation and emission) technology. The second objective is to focus on a 3D volume interconnect technology for reprogrammable N5 topologies.