ADVANCED PACKAGING AND MATERIALS FOR AVIONICS SYSTEMS

THE REQUIREMENTS NECESSARY TO DESIGN FUTURE HIGH PERFORMANCE AVIONICS SYSTEM INCLUDE BOTH HIGH DENSITY PACKAGING AND NEW MATERIALS ALLOWING AMONG OTHERS FOR SMART SKINS TO BE SUBSTITUTED FOR PREVIOUSLY CONVENTIONAL CIRCUIT BOARDS. HELMETS AND AIRCRAFT FUSELAGE UTILIZING SUCH APPROACHES WOULD BE INVESTIGATED IN ORDER TO ENABLE THE PILOT TO CONTROL HIS ABILITY TO ACT IN THE MANY WAYS NECESSARY WITHOUT CONFIGURATION. IT WOULD ALSO ENABLE MORE PRECISE CONTROL OF THE MANNED AIRCRAFT OR THE MANEUVERABILITY OF UNMANNED AIRCRAFT. RESEARCH INTO THE MATERIALS AND PROCESSES NECESSARY TO DETERMINE THE FEASIBILITY OF FABRICATING ELECTRONIC SYSTEMS THAT ARE HIGH SPEED, HIGH DENSITY, AND DISTRIBUTED WHICH ALLOWS FOR HIGH DENSITY INTERCONNECT, ELECTRONIC/ OPTIC SUBSTRATES AND MODULES CONTAINING SENSORS, VHSIC DEVICES AND OTHER VLSI CIRCUITS IS A PURPOSE OF THIS STUDY. MODULES AND MATERIALS WHICH REPLACE PRINTED CIRCUIT BOARDS FOR AVIONICS SYSTEM, COMPUTERS AND IMPROVED HELMET DESIGN WILL ALLOW NEW MISSION CAPABILITIES.MODULES CONTAINING SUBSTRATES WHICH PERMIT INTERCONNECT TO BE DEFINED BY SEMICONDUCTOR PROCESSES WILL ALLOW MUCH DENSER PLACEMENT THAN IS CURRENTLY ACHIEVED BY COFIRED AL2O3 SUBSTRATES. NEW MATERIALS BASED STRUCTURES COULD ALSO HAVE THE CAPABILITY TO HOUSEATESENSORS, FIBER OPTIC LINKS AND DEAL WITH SIGNAL PROCESSING.