SBIR/STTR Research Award
Development of Significantly Higher Efficiency TE Devices Using Ultraconductor (tm) Polymers
Award amount
$59,915Program and phase
SBIR · Phase IAward year
1997Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- Room Temperature
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
ROOTS proposes to develop an enabling technique for increasing the efficiency of thermoelectric devices, by application of Ultraconductor polymers as passive thermoelement ;. Increased figures of merit, or Z factor, resulting from the application of superconducting materials was first described in a landmark paper by H. I. Goldsmid, et al. Such devices have been developed and patented. Laboratory experiments using thin film Ultraconductor polymer in this way, as the passive leg in a TE module, indicates the Z factor might be sharply improved. A consultant's report indicates a similar improvement is likely in a power generating element. The application is a spin-off from a current USAF Phase II contract to increase present Ultraconductor film thickness to 100 or more microns. These proprietary polymers have demonstrated superconducting properties from 2K to 700 K (800F), and are usable at temperatures as high as 200 degrees C (390 F), allowing their employment in a variety of TE applications. The focus of this proposal is to prepare, characterize and measure Ultraconductor polymers in combination with thermoelectric materials for application to both thermoelectric coolers and generators. This project is expected to lead to slgnificantly increased efficiencies of TE devices, improving their utility for thermal management, energy generation, and cooling applications. This Ultraconductor application would also generate corporate interest for accelerated development and commercialization of additional Ultraconductor technologies, including Ultraconductor wire.
Technology keywords
Not reported