Multifunctional Structures for Aerospace Applications

This proposal describes the advancement of Multifunctional Structures (MFS) for Aerospace Applications in order to create a more efficient and capable system in terms of payload mass fractions. The proposed system, known as Flexible Electronics andStructure Integration System (FESTIS), continues the expansion of work performed in the MFS area by solving problems not yet overcome by state-of-the-art MFS technology. The basic approach to MFS is to reconfigure the cabling to improve the way theyintegrate into the aerospace vehicle structure, minimize mass and volume requirements, and to simplify the cabling manufacturing process. This proposal addresses these issues by focusing on the advancement of high density interconnects (EMI and RFconsiderations) and its application to advanced flexible circuitry. The principal behind WPI's concept is to take the developed technology and overcome problems encountered by detailing a new system. FESTIS will be capable of integrating new solutions andadvancing MFS to a full-scale working product that could be used for numerous aerospace vehicle electronic systems. Following technology development, WPI will commercialize the FESTIS using a 5-part process. The first step is to host a productdemonstration at WPI's in-house laboratory for the involved DoD agencies. Second, our system will undergo a field test on ABL subsystem with the resulting feedback guiding product improvement. The third step involves the trial production of a small numberof the FESTIS for interested DoD agencies. Fourth, WPI's marketing department will investigate alternative product applications. The final commercialization step is full production and product launch. Initially, the primary transition target for ourproduct launch is ABL equipment. However, this technology easily lends itself to future aerospace, aircraft, and ground vehicles. WPI estimates the annual market potential of FESTIS to be $6.5 billion.