H-60 Mission Avionics Technology Insertion

Current H-60 hardware is ROTS (Ruggedized off the Shelf). Although ROTS is less expensive than proprietary developed hardware, the cost is still projected to be significantly higher than commercially available alternatives. Within the next five years,many of the single board computer (SBC) boards and I/O cards will require redesign as the current microprocessors become obsolete and out of production. The opportunity presented by this k Technology Corporation (kTC) proposal is to develop anddemonstrate a low cost and reliable common card enclosure (CCE) to support commercial-off-the-shelf (COTS) electronic card formats to be used across multiple Navy platforms. The CCE is a proprietary structure placed around a COTS circuit card assembly(CCA). The shell provides a conduction thermal path for waste heat and acts to stiffen the card against high vibration and shock loads. This packaging format is compatible with all IEEE 1101.2 format circuit card assemblies (both COTS and ROTS). The twoinnovations, which will enable the wide use of this packaging concept are; 1) kTC's high conductivity k-Core material system and; 2) a low cost manufacturing technique to produce the material in the defined form. The common card enclosure to be developedwould have an immediate application to the system integrators of both airborne shipboard Navy Systems. Because the military specification for shipboard and submarine electronic equipment (MIL-STD-2036) allows for the acquisition of systems by performanceas opposed to design and because of the phasing out of full mill systems, there is a tremendous need for such a ruggidization technology.