Low Cost, Radiation Hard, Area I/O Electronic Package

Foster-Miller proposes to develop a low cost, thermally efficient, high input/output advanced electronic package using our innovative liquid crystal polymer technology. Liquid crystall polymer with low moisture permeability provides a hermetic seal in the interconnect. Laser drilled blind vias allow routing in the multilayer built with the LCP to achieve a high density of pads per square inch in the package array. Our innovative design includes a metal matrix cover sealed onto the substrate to provide efficient thermal management. This approach can handle high I/O (800 or more) wafer scale packaging as well as three dimensional stacks of MCMs. No other polymer-based approach can provide a hermetic package. Ceramic-based approaches are too expensive or cannot be implemented in such a space efficient manner. The multilayer substrate approach based on LCP also offers superior electrical properties. The substrate layers could be readily increased to provide features such as power distribution planes to control the characteristic impedance which will enable higher bandwidth applications. The material Foster-Miller uses can be fabricated with photo-lithography techniques used in thin film and is readily scalable to much higher I/O pin counts than conventional approaches. In Phase I, teaming with a Micro-Pak, laser drilling of LCP and hermetic sealing will be demonstrated by building several prototypes which will also show the thermal management technology and the circuit routing that provides the high density. In Phase II functional prototypes of 1600 and higher I/O will be built, assembled with functional ILS and fully tested. A thorough electrical, thermal and mechanical reliability characterization will be performed. This prototype will be based on an actual product being developed by our system designer team member.