NOVEL HIGH POWER SOLID STATE AMPLIFIER DESIGNS

JAMMER AMPLIFIERS FOR THE HF TO VHF RANGE NEED TO BE SMALLER, LIGHTER AND MORE CAPABLE. INTEGRATION METHODS BORROWED FROM IC FABRICATION PROMISE GREAT REWARDS. A STUDY IS PROPOSED TO INVESTIGATE CIRCUIT DESIGNS FOR APPLICABILITY TO INTEGRATION. PASSIVE COMPONENT ANALYSIS WILL BE PERFORMED TO SEE WHAT BENEFITS CAN BE GAINED. HYBRIDIZATION APPROACHES ARE FAVORED, BUT MONOLITHIC METHODS WILL BE CONSIDERED. CIRCUIT SYNTHESIS WILL BE CONDUCTED USING DEVICE MODELS DEVELOPED FROM MANUFACTURERS S-PARAMETERS. COMPUTER AIDED DESIGN METHODS WILL BE USED TO ANALYZE/OPTIMIZE VARIOUS TOPOLOGIES. PASSIVE COMPONENTS WILL ALSO BE MODELLED AND ANALYZED. BOTH MOSFETS AND BJTS WILL BE INVESTIGATED FOR SUITABILITY. DATA REPRESENTING THE STATE-OF-THE-ART WILL BE OBTAINED FOR THESE DEVICES. PRACTICAL ASPECTS SUCH AS DEVICE MOUNTING, COOLING AND FABRICATION OF CIRCURITY, ETC. WILL BE INCLUDED. TRAVELING-WAVE STRUCTURES WILL BE CONSIDERED FOR 1-200 MHZ POWER MOSFET AMPLIFIER APPLICATION. BUILDING BLOCK TYPE TECHNIQUES FOR COMBINING UNIT AMPLIFIERS WILL BE STUDIED. BREADBOARDS ILLUSTRATION INTEGRATION TECHNIQUES MAY BE CONSTRUCTED. EMPHASIS WILL BE ON PRACTICAL COMPONENT REALIZATIONS AIMED AT INTEGRATION.