LOW-COST BARE DIE TESTING FOR MULTICHIP MODULES

WE PROPOSE TO DEVELOP A SIMPLE, LOW-COST METHOD OF FULLY TESTING AND BURNING-IN BARE DIE BEFORE ASSEMBLY TO MULTICHIP MODULES. PREVIOUS APPROACHES IN THE INDUSTRY HAVE PROVED CUMBERSOME, COSTLY OR INEFFICIENT IN THEIR USE OF SUBSTRATE REAL ESTATE. THE PROPOSED APPROACH EMPLOYEES ENCLOSING THE BARE DIE IN A TEMPORARY REUSABLE PACKAGE. THIS PACKAGE, WHICH MATCHES THE FOOTPRINT OF THE EXISTING PACKAGED VERSION OF THE CHIP, ALLOWS FULL FUNCTIONAL TESTING AND BURN-IN BY THE MANUFACTURER. NO ADDITIONAL TESTING EQUIPMENT IS REQUIRED. THE CHIP IS REMOVED FROM THE TEMPORARY PACKAGE AND EITHER WIREBONDED OR FLIP-CHIP ATTACHED TO THE MCM. IN PHASE I WE WILL CARRY OUT FEASIBILITY STUDIES, BUILD AND DEMONSTRATE ELEMENTS OF THE APPROACH AND CREATE A PLAN FOR IMPLEMENTING THE APPROACH IN AN ACTUAL MCM DESIGN. PHASE II WILL INCLUDE THE DEVELOPMENT OF AN MCM DEMONSTRATING THE APPROACH ON SEVERAL DIFFERENT CHIP TYPES FROM DIFFERENT SOURCES. ANTICIPATED BENEFITS: MCMS FOR A BROAD RANGE OF SYSTEMS INCLUDING COMPUTERS, SIGNAL PROCESSORS, MASS MEMORY AND COMMUNICATIONS EQUIPMENT.