Design Tools for Integrated 3-Dimensional Electronic Circuits

"Major advances in the performance of digital and mixed signal circuits will be achieved with multifunctionality implemented at all levels and using novel circuit architectures to reduce latency. Achieving these goals will require significant advances inelectronic design aids. Heterogeneous integration of different technologies (for integrated modules) and the heterogeneous integration of different circuit architectures as with mixed signal and 3D monolithic circuits present numerous challenges to thedevelopment of an appropriate design environment. The particular challenge of three-dimensional placement and routing and accurate electro-thermal characterization (including full-wave electromagnetic interconnect modeling) is common to a very largecross-section of electronic problems where optimum performance is a premium.In the proposed project we will demonstrate the feasibility of designing 3D circuit architectures with minimum latency, using uncompromised electro-thermal modeling and full-wave interconnect modeling. We will demonstrate that constraint driven (includingelectro-thermal constraints) routing can be implemented using established routing software but concentrating on a performance driven routing rule generator. A range of routing tools can use the output of this generator, when appropriately formatted. Thus,the emphasis is on using advanced simulation and modeling technologies to realize predictive planning tools and