Nonintrusive System for Replication of Interlayer Printed Circuit Patterns

A three-dimensional imaging system using Compton X-ray backscattering will be designed. The proposed system will provide a non intrusive 3-D image with an altrahigh contrast ratio and resolution for the reconstruction of multilayer printed circuit board trace patterns. Image signal enhancement algorithms and processing techniques will be developed for converting the scanned 3-D image into circuit board patterns. A net list will be compiled based on the processed information gathered. The latter will be used to compare the actual connections of the traces on the multilayer printed circuit board.The primary goal in Phase I is to provide a detailed description of the system design and method for achieving the image quality required for reconstructing multilayer printed circuit boards. The design will be used to build a working prototype system for Phase II of the project.