Fabrication of Complex Copper Cooling Devices Using Ultrasonic Metal Consolidation to Locally Cool and Monitor High Energy Electron Sources

79778S One of the obstacles to the fabrication of high-brightness electron beam sources, used in next-generation linear colliders and linac-based light sources, is the unmet need for a cooling system. This project will develop a conformal cooling system that will greatly increase the thermal efficiencies required for new sources. The multilayer system will be composed of a copper outer layer (for electrical and thermal conductivity), followed by a layer of thermocouples or other temperature sensors located at regular intervals under the surface, followed by cooling channels, followed by a high-strength ¿backbone.¿ The embedded sensors will provide fine-grained temperature distribution information on the surface of the gun cavity, allowing constant monitoring during high-power operation and providing advanced warning of ¿hot-spot¿ formation. In Phase I, a previously-developed, ultrasonic consolidation, additive manufacturing technology will be used to create three test samples made from a copper-build material. The first sample will demonstrate the ability to create a conformal internal cooling channel that is not possible with conventional methods. The second and third samples will demonstrate the ability to embed sensors, such as thermocouples and fiber optics, beneath the electron gun surface. Commercial Applications and Other Benefits as described by the awardee: The technology should have application as thermal management devices in nearly every mechanical and electrical product. Examples include computers, automobiles, powered gardening tools, heat exchangers, and high gain, high brightness electron guns. The thermal management also would be lightweight, providing improved automotive fuel economy and reductions in environmental effects.