Fabrication process optimization for commercial manufacturing of millimeter wave components

CMB-S4, the next-generation cosmic microwave background experiment, requires a massive number of detector modules with micron-level precision at cryogenic temperatures. Current production capacity for critical coupling wafers is a bottleneck, threatening project timelines and cost. This limitation also impacts the development of scalable, low-noise superconducting qubit arrays for quantum computing. Solution: SEEQC proposes to optimize a microfabrication process for high-yield, high-throughput manufacturing of millimeter wave components, specifically focusing on coupling wafers. This process will leverage SEEQC's expertise in advanced lithography, etching, and 3D integration techniques. • Demonstrate a high-yield process: Implement pressing improvements identified in collaboration with FNAL, including resist process optimization and bonding material removal enhancement. • Optimize throughput: Identify and address production bottlenecks. • Collaborate with FNAL: Conduct quality control investigations, integrate coupling wafers into detector modules, and demonstrate end-to-end detector module performance. • Develop a new fabrication flow incorporating Phase I improvements. • Stress test the process flow to identify and resolve any remaining bottlenecks. • Demonstrate high-throughput production and assess mass fabrication plan for CMB-S4 wafer delivery. • Demonstrate end-to-end detector module performance in collaboration with national labs. This technology has broad applications in high energy physics experiments and quantum computing. For SEEQC, it directly supports the fabrication of scalable, low-noise superconducting qubit arrays with efficient I/O using capacitive and inductive coupling. This optimized process will enhance SEEQC's quantum computing platform, enabling the development of energy-efficient, commercially scalable quantum computing solutions for specific applications.