Advanced Thermal Spreader for High Power Density Microelectronics

Cu-Diamond composite is identified as a promising thermal spreader material. Cu-Diamond composite can be produced using conventional powder metallurgy processing technologies. Near-Net-Shape parts can also be produced. Diamond composite offers attractiveproperties with fewer limitations at more affordable price. With an estimated isotropic 600-1300 W/m.¿K thermal conductivity and a chip matching 6-10 ppm/¿K thermal expansion coefficient, Cu-Diamond spreader is perfect for high power densitymicroelectronic applications, e.g. laser diode assembly. Critical material and process related issues are identified and innovative solutions are proposed. Diamond selection criteria, new alloy development, and manufacturing process are examinedindividually. Special attentions are focused on maintaining diamond integrity during the processing and on near-net-shape fabrication. A product development team, consisting of material developer, material integrator, laser diode manufacturer, and systemintegrator has been assembled. In this proposed effort, we plan to fabricate up to 12 different prototype materials for evaluation and characterization. Thermal conductivity and expansion coefficient will be measured before and after thermal cycling. Atthe conclusion of the program, each member of the development team will offer an independent assessment on the overall technology and its market potential.An affordable high performance Cu-Diamond thermal spreader will be very beneficial for the next-generation high-power-density microelectronic packaging applications, e.g. laser diode assembly.