HIGH FREQUENCY MODELING OF MICROSTRIP AND CO-PLANAR CIRCUIT ELEMENTS

EFFICIENT NUMERICAL APPROACHES, VALID AT HIGH FREQUENCIES, WILL BE DEVELOPED FOR THE CHARACTERIZATION OF VARIOUS MILLIMETERWAVE MICROSTRIP AND CO-PLANAR COMPONENTS SUCH AS COUPLED LINES, DISCONTINUITIES,AND SO ON. EXISTING AND NEWLY DEVELOPED HIGH FREQUENCY ANALYSES AND COMPUTER CODES WILL BE ADAPTED FOR IMPLEMENTATION ON A MICROCOMPUTER. BOTH OPEN AND SHIELDED CONFIGURATIONS WILL BE CONSIDERED. THE MODELS WILL INCLUDE ALL THE PHYSICAL PHENOMENA SUCH AS RADIATION LOSS, SURFACE WAVES, AND HIGHER ORDER EFFECTS. ALL MATERIAL LAYER EFFECTS ARE FULLY AND ACCURATELY INCORPORATED INTO THE SOLUTION. THE RESULTS ARE ACCURATE TO THE EXTENT THAT THE MATERIALS ARE ACCURATELY CHARACTERIZED. THE IMMEDIATE PURPOSE IS TO DEMONSTRATE THE FEASIBILITY OF ADAPTING HIGH FREQUENCY MODELS OF MICROSTRIP AND CO-PLANAR ELEMENTS TO MICROCOMPUTER CODES.