LCP-Based Packaging of Exposed MEMS Sensors

Over many years of development, the microelectronics industry yielded a broad set of advanced microelectronics packaging techniques. These techniques have been designed to increase the reliability of microelectronic devices under harsh operating conditionsby isolating the devices from the environment. However, these techniques are unsuitable for environmental MEMS sensors that require exposure to the environment. Humidity sensors and chemical sensors are two examples of MEMS sensors requiring this exposure.To meet the packaging needs of these devices, new package designs, packaging materials, and packaging techniques arerequired. The first phase of this SBIR effort resulted in package designs based on new materials and packaging techniques that will enhancethe reliability of exposed MEMS sensors. Phase I perfomed materials compatibility studies, developed package designs and concepts, and performed experiments to verify aspects of concept feasibility. The proposed Phase II will develop engineering prototypepackages suitable for environmental testing and screening, as well as result in packaged MEMS sensors exposed to the environment.