Isotropic Graphite Fiber Reinforced Al for High Performance Thermal Management Applications

"The rise of next generation electronics depends on advances in microelectronic packaging materials. Power, frequency, and functionality are increasing while cost, size, and margin for error are declining. Military and commercial electronics are reachingperformance limitations since conventional CTE controlled heat sink materials are unable to keep pace with emerging cooling requirements. Graphite aluminum composites represent a breakthrough opportunity for the high reliability microelectronics industryby providing a new class of CTE matched heat sink materials that could facilitate substantial cost and performance benefits. Most electronics cooling applications require a high degree of through thickness cooling in the range of 200 W/Mk - a performancecriteria that has not been achieved due to the anisotropic nature of fiber reinforced composites. But recent achievements in graphite fiber manufacturing processes, combined with cheaper raw material costs, have allowed MMCC to examine production ofisotropic graphite aluminum composites for widespread use in commercial and military electronics. MMCC, with phase I support from BMDO, will team with a non-woven textile company, a microelectronic packaging contractor, and military and commercial endusers to develop, qualify, and commercialize a high performance, isotropic graphite aluminum composite for thermal management applications. Improve the performance of multichip packaging te