High Temperature Metal Ceramic Packing

Strong, durable and vacuum tight seals between SiC or diamond films and copper and other materials are needed for high density packaging/interconnect applications. Presently, there are many problems in joining these very dissimilar materials to form reliable and strong bonds. Most of these problems are related to large difference in their melting temperatures and with non-adherent oxides of the metals. For high-temperature applications, problems in the mismatch of their thermal expansion coefficients would also be quite serious. This proposed research will develop novel surface prosesses to address these problems, especially to reduce dynamic stresses generated during temperature fluctuations. Phase I will demonstrate and test the thermal stability and strength of joints made of SiC and diamond films to copper. Phase II will involve optimization of the processes in terms of uniformity, reliability, durability and cost effectiveness. Phase III will develop potential applications of electronic packaging in manufacturing and specific applications.