High Performance Dielectrics for High Energy Density Capacitors

Aspen Systems proposes to develop high dielectric constant (K), low loss tellurium polymers to meet the design objectives of high energy density capacitors. In the proposed Phase I program we will apply rigorous computational chemical techniques to predict the properties of this new class of polymers. We will attempt the synthesis of the parent polymer of the tellurium family, fabricate films for testing, and measure its electrical properties. initial calculations indicate that these polymers will have better dielectric properties than analogous polymers containing sulfur and selenium. Dr. William Welsh, University of Missouri, St. Louis, will serve as the modeling consultant, and Dr. Daniel Sandman, University of Massachusetts, Lowell, will guide the synthetic work. The development of materials like these proposed polymers are crucial to overcoming the current plateau in dielectric materials development. The development of high dielectric constant, low loss dielectrics will have immediate application in meeting the needs for high energy density capacitors.