SBIR/STTR Research Award
Featherweight Displays (FWDs):Ultra-bright VCSEL-based, Full-color Microdisplays using Solderless Nanoscale Interconnects
Award amount
$99,815Program and phase
SBIR · Phase IAward year
2003Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- E-VIZ, INC.
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
The Feather Weight Display is a novel design and integration of industrially mature technologies including ultra-density silicon circuits with ultra-dense chip-to-chip interconnections, ultra-density VCSEL arrays, nonlinear photonic upconverting colormaterials, and nonlinear optical elements. To demonstrate its potential is primarily a design process. Design of emissive and virtual retinal devices and the identification of industry processes will be accomplished quickly. There are a full spectrum ofusers in the personal microdisplay market, each have distinct issues that must be overcome to be able to provide a winning combination of features. The primary need for the military user is all-weather functionality and low power drain. Size is alsoimportant, but somewhat secondary to other parameters.Reviewing the conditions within international consumer microdisplay market, one fines two primary issues that collide and prevent market from eruption with acceptable products and services. The first is personal vanity. People want and need to lookfashionable if not 'cool'. All current personal displays are too large, bulky, cumbersome, and unstylish to blend into the typical person's wardrobe, lifestyle, and social image. Secondly Cost.The primary benefit from this is the demonstration of higher integrated, lighter, more capable electronics packages. This is useful for not only for the creation of the Feather Weight Display, but also for many other advanced systems including sensors,transmitters, receivers and more. Demonstrating this process will allow the creation of complex assemblies by utilizing the different venders for each specialized function. This will demonstrate how a broad base of highly specialized single purposecircuits suppliers' devices can be integrated into a smaller and lighter package.
Technology keywords
Not reported