Machine Vision Based Multisensor Inspection for Microelectronics

This proposal describes the implementation of improved processes for inspection of micro-electronic assemblies based upon integration and fusion of data from different sensor modalities. Initially the project will be targeted on developing a system that combines data from a CCD camera operating with visible light, a micro focus X-rays imaging system, and a laser based pointrange sensor. Although the initial focus will be detection of defects in solder joints in gull wing SMT components using the the sensors mentioned above, the system and software architecture will be designed to integrate data from a wide range of sensors at different levels of data abstraction. System development will be founded on Acuity Imagin's range of standard platform based machine vision systems and will make full use of the image acquisition, image processing, image manipulation and feature extraction capabilities already present in these systems. Phase I tasks include: brief review of related work; analysis of application requirements; definition of system functionality and specifications; finalization of proposed system architecture and development of detailed hardware/software designs; development of limited breadboard prototypes. Based on the above work, needs for future R&D will be identified and Phase II efforts will be planned.