Integrated Physical Modeling and Analysis of Microelectronics

A CAD framework to assist process engineers and designers in conceptuallizing, designing, simulating, and optimizing the performance of microelectronic devices is proposed. It will manage extensive manufacturing data, data representing the description of a system, and thermal, electronics, electromagnetic analysis results. It will enable use of multiple and inter-related simulation engines for development of microelectronics devices. It will be ready for integration of additional tools by using an open architecture. The Phase I effort will be to extend the architecture of IntelliSense's current CAD tools (for microelectromechanical systems) to include microelectronics devices. This extension will call for the development of the necessary tool-independent open-architecture framework in order to link the physical description of a microelectronic device with simulation and behavioral models such as thermal, electrostatic and electromagnetic analysis. Activities will include benchmarking the architectgure using common and standard processes. In Phase II, the framework developed in Phase I will be used as a blue print to implement the core technology of the microelectronic CAD proposed. Commercialization will be through the existing market channels of IntelliSense.