Electronic Module Maker System

Future military and industrial electronic systems depend upon increased circuit density, performance, complexity, and reliability with an attendant decrease in size, weight, power, and cost. Industry must develop the capability to fabricate functionally integrated multi-component modules (MCMs) as 3D structures designed for application specific needs. This will be achieved by the proposed Electronic ModuleMaker system using precision layered fabrication technology that will fabricate an equivalent MCM two orders of magnitude faster than tape casting methods. The two stages of MCM fabrication where significant benefits are realized are the substrate fabrication with integrated conductive interconnects (including vias), and the attachment or deposition of passive components. The first stage will be developed during Phase I. The second stage of fabrication of integrated passive components will be developed and demonstrated in Phase II. The EMM offers increased reliability, yield, circuit density, and repeatability; as well as in situ fabrication, unlimited layers, and replication ability. It offers a dramatic reduction of cost, training, and faster time-to-market. MCM fabrication is beleaguered by labor-intensive techniques, high complexity, and low yield. The EMM system is an automated in situ process that can fabricate multiple MCM's simultaneously with nearly unlimited number of layers and higher yields.