Fabrication of Complex Copper Cooling Devices Using Ultrasonic Metal Consolidation to Locally Cool and Monitor High Energy Electron Sources

The performance requirements for next-generation linear colliders and linear-accelerator-based light sources, such as X-ray free electron lasers, place extreme demands upon the electron beam source. Higher field gradients in the electron gun are required to maintain beam quality and beam energy, in order to increase the peak power (and heat) load applied to the gun. As of now, there is no practical way to provide the required cooling to the interior structures of the gun, while concurrently providing a means of monitoring conditions inside the gun cavities. This project addresses this need by extending the advantages of ultrasonic consolidation to copper-based systems. Ultrasonic consolidation, a unique and proprietary adaptation of ultrasonic welding used previously for aluminum, allows for the production of parts with complex interior geometries that would be impossible to achieve otherwise. Phase I demonstrated the viability of ultrasonically consolidating laminate copper structures, which included embedded optical fibers, thermocouples, and internal cooling channels. Phase II will produce complex functioning prototype parts ¿ a cathode plate for a high brightness gun with sensors embedded in the plate, and an x-ray photon mask with cooling channels and temperature sensors ¿ that address the critical cooling requirements of high power, high brightness electron guns. Commercial Applications and other Benefits as described by the awardee: A strong commercial market for instrumented complex copper structures would exist in high performance thermal management devices. Initial applications include high-brightness electron beam sources, high performance electronics, and active cooling of coal gasifiers.