Optoelectronic MCMs and Boards Based on Light Distributing Interconnect Active (LIDIA) Substrates

Physcial Optics Corporation (POC) proposes a novel inter-MCM and intra-MCM optoelectronic interconnect, based on polymeric light distributing interconnect active (LIDIA) substrates. Based on indirect electro-optic (EO) modulation, and an external optical power supply, the LIDIA optoelectronic interconnects are radiation-hardened and fully-compatible with integrated-circuit technology. In contrast to previous optoelectronic interconnect concepts, these substrates will allow direct communication betwen silicon chips and MCMs, without the involvement of GaAs-chips. Also, they have higher reliability and much lower electrical power consumption. In addition, they can be physically scaled to the inter-MCM interconnect level without a costly modification of CMOS state-of-the-art technology. The LIDIA concept is supported by many POCs proprietary and patented technologies.