SBIR Phase I: CMP Slurry Monitor

This SBIR Phase I project is to develop a Chemical Mechanical Polishing (CMP) Slurry Monitor as a fully in-line, real-time, point of use instrument that will detect and disperse large agglomerates in the nanofine slurries used in IC manufacture. The monitor will not only detect scratch inducing agglomerates but will also attempt to destroy them. Successful development of the slurry monitor will improve yields and decrease costs for the semiconductor industry. The principles of induced microcavitation may find wide applications in liquid/particle processing. By detecting and destroying agglomerates improved processes and products will be enabled.