HIGH THERMAL CONDUCTIVITY ELECTRONIC SUBSTRATE

WE PROPOSE TO INITIATE DEVELOPMENT OF A HIGH THERMAL CONDUCTIVITY PRINTED CIRCUIT BOARD (PCB) ASSEMBLY. USE OF A HEAT PIPE TECHNIQUE IS EXPECTED TO YIELD THERMAL CONDUCTIVITIES MANY TIMES THAT OF COPPER OR EXPENSIVE CERAMICS. THE PRINCIPLES OF HEAT PIPE OPERATION ARE DISCUSSED, AND A SIMPLE PRINTED CIRCUIT BOARD CONSTRUCTION IS PROPOSED TO TAKE ADVANTAGE OF THOSE PRINCIPLES. USE OF THIS TECHNIQUE PROMISES TO ELIMINATE DISCREET HEAT SINKS IN MANY APPLICATIONS. PHASE I WORK WILL DEMONSTRATE THE FEASIBILITY OF A HEAT PIPE/PRINTED CIRCUIT BOARD HYBRID. A COMPUTER MODEL WILL BE DEVELOPED AND USED TO OPTIMIZE THE DESIGN OF A PROTOTYPE. PROTOTYPE DEVICES TO BE FABRICATED AND TESTED IN PHASE II WORK WILL USE AVAILABLE MATERIALS AND CONSTRUCTION TECHNIQUES. THESE DEVICES WILL BE TESTED TO DETERMINE THEIR OPERATING LIMITS.