REAL TIME MONITORING OF INFRARED DETECTED THERMAL SIGNATURES OF TAB INTERCONNECTIONS ...

WE HAVE PREVIOUSLY DESIGNED AN INSPECTION STATION IMPLEMENTING INFRARED DETECTED THERMAL SIGNATURES FOR THE MONITORINGOF MECHANICAL INTEGRITY OF TAPE AUTOMATED BONDED (TAB) INTERCONNECTIONS. IN THIS RESEARCH WE WISH TO APPLY VARIOUS SIGNAL PROCESSING TECHNIQUES TO THIS DESIGN IN ORDER TO EVALUATE THE FEASIBLITY OF USING THISMODIFIED WORK STATION TO MONITOR THE TRANSMISSION LINE CHARACTERISTICS OF THE TAB BONDED INTERCONNECTIONS. THERE IS A NEED FOR THIS WORK STATION BECAUSE MUCH THE ESCALATING EXPENSE IN THE MULTICHIP MODULE FRABRICATION IS BROUGHT ON BECAUSE OF THE INABILITY TO MONITOR THE ELECTRICAL QUALITIES OF THE INTERCONNECTIONS, SUCH AS IMPEDANCE PERTURBATIONS AND DISCONTINUITITES, AND CROSS TALK, WHEN HIGH QUALITY ELECTRICAL SIGNALS ARE REQUIRED FOR RELIABLE OPERATION. THE PROPOSED WORK STATIONIS COMPLETELY AUTOMATED, AND WE WILL EVALUATE THE FEASILIBTY OF USINGSIGNAL PROCESSING TECHNIQUES FOR OBTAINING REAL TIME MEASUREMENTS OF THE ELECTRICAL CHARACTERISTICS AT THE INPSECTION STATION. ANTICIPATED BENEFITS/POTENTIAL COMMERCIAL APPLICATIONS OF THE RESEARCH OR DEVELOPMENT. IF THIS RESEARCH IS SUCCESSFULLY COMPLETED, WE WILL BE ABLE TOREDUCE FABRICATION COSTS OF MULTICHIP MODULES UP TO EIGHTY PERCENT BYIMPLEMENTING IN-SITU MONITORING OF THE ELECTRICAL CHARACTERISTICS WHILE THE MODULES ARE BEING ASSEMBLED. THESE COSTS WILL BE REDUCED BY REDUCTION OF REWORK NOW REQUIRED AFTER ELECTRICAL INSPECTION.