COMPOSITES FOR INTEGRAL DIELECTRIC/HEAT SINK FOR ELECTRONIC DEVICES

THE OBJECTIVE OF THIS PROGRAM IS TO SHOW THE FEASIBILITY OF FABRICATING AN INTEGRAL DIELECTRIC/HEAT SINK USING ORGANIC MATRIX COMPOSITES. SEM E PROPERTY REQUIREMENTS WILL BE GOALS. HIGH THERMAL CONDUCTIVITY GRAPHIT FIBERS (1100 W/M DEG K) WILL BE USED TO ACHIEVE THE SEM E HEAT SINK THERMAL CONDUCTIVITY REQUIREMENT. THE USE OF THESE FIBERS WILL LEAD TO A NEGATIVE EXPANSION IN THE HEAT SINK. THEREFORE, METAL ADDITONS TO THE HEAT SINK WILL BE MADE TO INCREASE THE THERMAL EXPANSION TO MATCH THE GLASS-EPOXY SEM E DIELECTRIC. IT IS PLANNED TO USE BOTH A COPPER-COATED GRAPHITE FIBER TOW AND GRAPHITE-ALUMINUM WIRE FOR THIS PURPOSE. THIS TECHNOLOGY WILL BE DEMONSTRATED IN BOTH EPOXY AND THERMOPLASTIC COMPOSITES. HEAT SINK JOINING TO THE DIELECTRIC WILL BE ACCOMPLISHED BY CO-CURING OR COMPRESSION MOLDING. EVALUATION WILL BE BASED ON THERMAL AND MECHANICAL PROPERTIES MEASURED BEFORE AND AFTER THERMAL CYCLING, USING SEM E SPECIFICATIONS. OF PARTICULAR IMPORTANCE IS A COMPARISON OF PROPERTIES OF THE INTEGRAL DIELECTRIC/HEAT SINK WITH ADHESIVELY BONDED COMPONENTS. SYSTEM IMPACT ASSESSMENT WILL INCLUDE A COMPARISON OF THE POTENTIAL OF ORGANIC MATRIX COMPOSITES WITH CERAMIC MATERIALS SUCH AS BEO.