Computer Assisted Modeling of Urban Environments

Not Available Extreme miniaturization of sensors such as inertial measurement units IMUs has become possible with the development of micro-machining technologies. In addition to reducing size and weight, unprecedented reductions in cost and power consumption have been achieved. Unfortunately, performance has been the trade-off. Sensor structures created from very thin films have low lateral sensitivity, and lack structural rigidity perpendicular to the substrate. Bulk techniques provide promise, but may impede multi-axis measurement. To achieve IMU performance necessary for next generation small missiles, hybrid processes need to be developed. Current thin-film processes are characterized by alternating layers of materials such as polycrystalline silicon, silicon dioxide, silicon nitride, doped glasses, and contact metallizations. Major limitations of current thin film MEMS fabrication processes are: limited inertial mass and cross-sectional area, fixed and constant layer thicknesses, limited flexibility for vertical actuation mechanisms, in-situ vacuum encapsulation, and choice of layer materials. It is the goal of the proposed research to develop a thick-film fabrication process analogous to commercially available thin-film processes, such as MCNC's MUMPS process or Sandia's SUMMiT process. This thick film process will combine SOI, wafer bonding, and deep RIE with traditional thin-film processes to provide a flexible process without the current limitations.