Non-Destructive Real-Time In-Situ Analysis of Vacuum Grown and Processed Infrared Material and Senso

The objective of the proposed project is to develop innovative new analytical instrumentation and methodology capable of performing fully automated, non-destructive analysis of semiconductor sensor elements and arrays locate on three inch diameter wafers. The instrumentation would be capable of analyzing II-VI compounds and alloys, particularly HgCdTe. The methodology would employ state-of-the-art electron optics and signal processing electronics to maximize instrument resolution and throughput while minimizing damage due to the incident electron beam. The proposed project has been divided into two Phases. Phase I consists primarily of a research phase in which the overall system requirements would be investigated and formalized, and a construction phase during which the basic system. components would be designed and constructed. During Phase II, the remaining components (primarily analytical) would be constructed and installed, yielding an instrument which is fully integrated and automatic. It is therefore important that a thorough and detailed design be completed during the Phase I effort, to allow straightforward addition of components during Phase II. All manufacturers of microcircuitry should find this technology to be highly useful for their research and development efforts when interfaced with their manufacturing systems. Researchers in materials science and surface analysis should also find the equipment and methodology developed in this project useful, as it will represent the state of the art