EFFECTS OF LONG-TERM STORAGE ON ELECTRONIC DEVICES

THE PURPOSE OF THIS PROJECT IS TO IDENTIFY FAILURE MECHANISMS AND STRESSES ASSOCIATED WITH LONG-TERM STORAGE OF ELECTRONIC DEVICES, TO IDENTIFY COST EFFECTIVE PACKAGING TECHNIQUES FOR PROTECTING ELECTRONIC DEVICES DURING LONG-TERM STORAGE AND TO ASSESS NEW TECHNOLOGIES AND DESIGN METHODS FOR PROTECTING ELECTRONIC DEVICES DURING LONG-TERM STORAGE. THIS STUDY WILL LAY THE FOUNDATION FOR THE PHASE II PROJECT WHICH INVOLVES DEVELOPING GUIDELINES SPECIFICALLY FOR THOSE CRITICAL ELECTRONICS LOCATED IN INFRARED (IR), MILLIMETER WAVE (MMW) SENSORS, AND ASSOCIATED SMART MUNITION ELECTRONICS. THE KEY FACTOR IS TO DETERMINE FAILURE MECHANISMS DUE TO STORAGE CONDITIONS AND COST EFFECTIVE PACKAGING METHODS FOR PROTECTION. THIS REQUIRES THE INVESTIGATION OF THE VARIOUS PHYSICS OF FAILURE MECHANISMS AND MODES OF FAILURE FOR ELECTRONIC MATERIALS AND DEVICES.