The Integration of Individual Superconductor Substrates into a Multichip Module

The ability to laminate layers of superconducting materials into a multilayer module is the goal of this research and exploratory development program. Advanced applications will require a large number of chips to perform high speed calculations. Superconductors provide low loss dispersionless interconnection, as well as low power, high speed alternatives to conventional technology. A multilayer multichip module would significantly advance superconducting technology, but little work has been done in this area. StratEdge Corporation fabricates high performance ceramic multichip modules through the use of a set of specially formulated laminating materials. This develop laminating materials and processes that will be compatible with existing superconducting materials. The specific superconducting materials to be inter multilayer structure are yttrium-barium-copper oxide (YBCO) on a lanthanum (YBCO) on a lanthanum aluminate (LaA103) carrier. The proposed multilayer ceramic approach will be used to provide strength integration, and lower cost. StratEdge has obtained the support of a large systems that will provide superconducting materials and expertise on both the Phase I and II programs.