SBIR/STTR Research Award
Rigid-Rod Polymers for Low Cost MCM's
Award amount
$746,505Program and phase
SBIR · Phase IIAward year
1996Award details
- Awarding agency
- Department of Defense
- Branch
- Defense Advanced Research Projects Agency
- Recipient company
- Maxdem, Inc.
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
New dielectric films having coefficient of thermal expansion matched to either copper or silicon will be developed based on processable Poly-X (tm) polyphenylenes. These films will have important applications in laminates for Multichip Modules (MCM) and other advanced packaging techniques. The unique combination of rigid-rod backbone and amorphous form will result in film properties not possible with existing materials. Poly-X (tm) resins also have very low dielectric constants and moisture uptake. Anticipated Benefits: Development of low coefficient of thermal expansion dielectric films and laminates will enable low cost fabrication of Multichip Modules.
Technology keywords
Not reported