SBIR Phase II: Integration of Advanced Power Electronics through the Packaging of High Temperature Silicon-Carbide (SiC) Based Multichip Power Modules (MCPMs)
Award amount
$99,802Program and phase
SBIR · Phase IAward year
2004Award details
- Awarding agency
- National Science Foundation
- Branch
- Not reported
- Recipient company
- Aspire Solutions, Inc
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- LTKJJZTDMKP4
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Just In Time (JIT) Component Presentation
- Improved Methodology for Engineering Repair Process
- Condition Based Maintenance: Planning and Implementation
- Improved Methodology for Engineering Repair Process
- Distributed, Multi-Echelon Logistics Management
Research funding history
12 SBIR/STTR records share this UEI (2004–2015). Reported award amounts total $5,538,225. Reported amounts are not federal obligations.
Phases: Phase II, Phase I
Agencies: Department of Defense, National Science Foundation