Micromachined, Three-Dimensionally Integrated RF or RF-Optoelectronic Circuit Components

"The use of 3D, micromachined high resistivity silicon to fabricate high frequency RF circuits which are self packaged and hermetic has been successfully demonstrated. To incorporate optical components in the hermetic silicon package an equivalent opticalexit port from the hermetic package needs to be developed. We propose the demonstration of a compact, low cost, hermetic optical port using micromachined silicon for passive alignment of fibers and polymeric optical components to complement the RF hermeticports that have been successfully demonstrated in the literature. If successful, this proposal will demonstrate the ability to make a compact, low cost, hermetic optical port using micromachined silicon to complement the RF hermetic ports using siliconthat have been successfully demonstrated in the literature. Such an optical port is essential if 3D micromachined high density circuits are to reach their full potential for optoelectronic circuits. Will reduce cost of optical components manufacture byfactor of 10. For DOD applications this means the ability to deploy sophisticated optical networks in the field and on the individual soldier level."