Ball Grid Array Compatible, Optical Packaging and Assembly Process

72886S03-I High-Energy Physics (HEP) experiments at the Large Hadron Collider utilize more than 90 million signal channels among different types of detectors, with total aggregate data rates of 40TB/s. There is a need for an advanced chip-to-chip interconnect that addresses power dissipation, interconnect density, and reliability. Because cost is an issue, compatibility with standard manufacturing techniques is essential. This project will develop a Ball Grid Array Compatible, Optical Packaging and Assembly Process (OBGA) for use with large area arrays in HEP detector applications. Multi-Tb/s-bandwidth packaging will provide ultra low power and unprecedented input/output density. Phase I will prove the feasibility of the OBGA concept through technology demonstration and optical simulation study. The packaging concept will be thoroughly evaluated, and a packaging process will be recommended for implementation in Phase II. Commercial Applications and Other Benefits as described by awardee: The OBGA-based chip-to-chip interconnect should lead to a new performance class of large-scale computer and communication systems, reducing power dissipation and latency while adding virtually unlimited data throughput.