WAVE (Wide-bandgap Affordable Versatile Electronics) Chip Technology

The WAVE (Wide-bandgap Affordable Versatile Electronics) chip technology addresses the challenges associated with high-power, high-efficiency, cost-effective MMIC chips in Air Force applications. Traditional MMIC designs, particularly those based on silicon or GaAs (Gallium Arsenide), are limited by their lower breakdown voltage, power density, and thermal conductivity, making them unsuitable for high-frequency, high-power applications like radar systems, satellite communications, and wireless power transmission.WAVE chips, built on GaN (Gallium Nitride) on SiC (Silicon Carbide) substrates, provide superior power density, thermal management, and efficiency. WAVE technology achieves an industry-leading 65% power efficiency at 24 GHz, surpassing traditional silicon-based MMICs. In addition to their high performance, WAVE chips are 20x cheaper than standard GaN chips, thanks to innovative manufacturing techniques such as heterogeneous integration. This combination of high efficiency and low cost makes WAVE chips ideal for radar, secure communications, and wireless power transmission systems within Air Force operations.Phase I Activities:Demonstrating Technical Feasibility: Fresnel will validate the performance of WAVE chips in radar and communication systems, focusing on power efficiency, thermal stability, and scalability for Air Force missions.Customer Discovery: Engage with Air Force stakeholders to assess specific requirements for power amplifiers and rectifiers and align WAVE technology with the needs of various Air Force operations.This project lays the groundwork for the further development and integration of WAVE GaN MMIC chips into Air Force systems, with the potential to transform critical applications by providing high-efficiency, cost-effective solutions for long-range radar, secure communication, and wireless power transmission.