SBIR/STTR Research Award

AUTOMATED ELECTRONIC CIRCUIT MANUFACTURING USING INK JET TECHNOLOGY

Award identifier 9dc3b8951ab3322bba663c2a4a934224a32978322d0b3788bbcbf3d3fb15ad15Awarding agency National Science Foundation

Award amount

$50,000

Program and phase

SBIR · Phase I

Award year

1988

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Award details

Awarding agency
National Science Foundation
Branch
Not reported
Recipient company
MicroFab Technologies Inc
Proposal award date
Not reported
Contract end date
Not reported
UEI
VAJ2W9CDYXT9
Solicitation number
Not reported
Topic code
Not reported

Research abstract

THE FEASIBILITY OF PRODUCING ELECTRONIC CIRCUIT BOARDS, FLEXIBLE CIRCUITS, AND INTEGRATED CIRCUIT PACKAGES USING INKJET TECHNOLOGY WILL BE EVALUATED. IF SUCCESSFUL, THIS METHOD COULD BE INTERFACED WITH COMPUTER AIDED DESIGN SYSTEMS TO PRODUCE RAPID TURNAROUND OF PROTOTYPES. PACKAGING IS CURRENTLY ONE OF THE PACING ITEMS IN MOST CUSTOM CIRCUIT DEVELOPMENT. APPLICATION TO FOUR SPECIFIC CIRCUIT PROCESSES WILL BE EVALUATED. IC TAB BONDING CIRCUITS, CONVENTIONAL IC PACKAGING, FLEX CIRCUITS, AND PC BOARDS. THE FEASIBILITY OFPRODUCING THE ABOVE WILL BE EXAMINED USING A VARIETY OF MATERIALS (BOTH CONDUCTIVE AND MASKING) AND SUBSTRATES.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

58 SBIR/STTR records share this UEI (1988–2015). Reported award amounts total $12,968,991. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Health and Human Services, National Science Foundation, Department of Defense, National Aeronautics and Space Administration, Environmental Protection Agency, Department of Commerce

Agency intelligence

National Science Foundation

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